Canteliver Probe Card
MPI Cantilever Probe Card is broadly used on gold bump and pad wafer testing for Exhibit driver, logic, and memory device. MPI’s cantilever probes are definitely the corresponding respond to for the calls for of fine pitch, smaller pad sizing, higher speed, a lot less cleansing, multi-DUT, superior pin depend, and extremely-low leakage needs. With fantastic craftsmanship, ground breaking architecture and confirmed methodologies depending on mechanical and electrical simulation/measurement final results, generating MPI the highest cantilever company around the globe.
FCB Probe Card
The FCB Probe Card is easily the most experienced know-how of buckling beam probe card. It can be aimed to accomplish the semiconductor ship manufacture time-to-current market (TTM) and price of examination (COT) need. FCB is actually a verified Remedy for a number of semiconductor production checks from early engineering pilot-operates to substantial volume producing (HVM). FCB is prepared for unit requiring high sign integrity probing (SI) and/or electricity integrity probing (PI). Programs consist of chopping-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, plus much more. FCB ensures the planet’s best Over-all Value-of-ownership (COO) for several DUT programs.
EVS Probe Card
The EVS Probe Card is an improvement more than the standard buckling beam probe card. Essential attributes are bigger recent carrying capacity (C.C.C.) and decrease balanced Get hold of power (BCF), and All round MEMS-like characteristics. EVS can easily fulfill the requirement here of State-of-the-art wafer probing. Precise alignment and great planarity Manage tend to be the important components contributing to steady Get hold of resistance. With its capability and efficiency, EVS Probe Card is a super choice for Innovative probe playing cards.
Osprey probe card
The Osprey probe card is MPI’s solution to need for at any time finer pitch. It is actually designed for more compact Al pad, which is perfect for tiny pitch application with peripheral and total array sample. With specific alignment and improved planarity Manage, Osprey can get to better efficiency by multi-DUT design. The forming wire (FW) kind needle developed with MPI’s personal micro fabrication approach not just provides high-high quality functionality and also lets simple needle alternative and shortens retaining cycle time.
Kestrel Probe Card
The Kestrel Probe Card is supplied with MEMS wire (MW) needle that is designed for the demand from customers of small pressure probing. In addition it includes the ability to fulfill higher C.C.C. and higher pin counts application. The MEMS approach guarantees hugely reliable needle properties, along with the Exclusive framework style allows exact alignment and planarity Handle.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/